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High Q MMIC Spiral Inductor Study Using Production Silicon Process

机译:使用生产硅工艺的高Q MMIC螺旋电感器研究

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摘要

This paper documents the results of a study based on measurements of 240 microwave monolithic spiral inductors fabricated using an industry standard silicon process. Measurements at frequencies between 1GHz and 40GHz are presented which demosntrate inductance values of 0.4nH are achievable at 15GHz with quality factors of 20. To the authors knowledge this is noe of the highest reported Qs of a monolithic inductor created in a standard RF silicon process. Four square and four octagonal inductors were design with target inductances of 0.4nH, 0.5nH, 1.0nH, and 1.5nH. Each inductor was fabricated three ways: in top metal only, in top and second from top metal layers with the layers joined by vias along the length of the inductor, and in top metal with a 1mum wide trench in the silicon substrate betwee nthe inductor windings. Ten of each inductor version were measured to increase the statistical significance of the results. Three de-embedding techniques for removing pad and feed line parasitics from the inductor measurements are discussed. As well, the efficacy of HP EEsof Series IV Momentum in predicting the performance of one of the square inductors is presented.
机译:本文记录了基于使用工业标准硅工艺制造的240个微波单片螺旋电感器的测量结果的研究结果。给出了在1GHz和40GHz之间的频率下的测量结果,在15GHz处具有20的品质因数,可以实现0.4nH的去电感值。据作者所知,这并不是标准RF硅工艺中所报道的单片电感器的最高Qs。设计了四个方形和四个八边形电感器,目标电感分别为0.4nH,0.5nH,1.0nH和1.5nH。每个电感器均以三种方式制造:仅在顶部金属中,在顶部金属层中从顶部金属层开始,然后在顶部金属层中第二层,并且各层通过沿电感器长度的通孔相连,并且在顶部金属中在电感器绕组之间的硅衬底中具有1mm的沟槽。每个电感器版本中的十个被测量以增加结果的统计显着性。讨论了三种从电感测量中消除焊盘和馈线寄生的去嵌入技术。同时,还介绍了HP EEsof IV动量在预测方形电感器之一性能方面的功效。

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