Session 11 overview: Sensors and MEMS: Imagers, MEMS, medical and displays subcommittee

摘要

This session presents recent advances in sensor interfaces for MEMS as well as temperature sensors. The papers span industrial and academic contributions. They exceed industry standard specifications and reveal innovative solutions. The first 4 papers describe capacitive sensor interfaces that bias MEMS microphones, compensate package-related offset, advance precision-displacement sensing, and address sustainability in harsh environments. The last 4 papers describe temperature sensors, which are becoming ubiquitous parts of integrated systems. The papers set new records in temperature range, accuracy, power efficiency, and level of integration by introducing new architectures, advances in technology, and circuit-level innovation.