Advances in Sputter Hardware for Rotating Cylindrical Magnetron Sputtering

摘要

Magnetron sputtering, combined with an accurate control of process parameters and layer quality, has proven to be one of the most important methods for thin film deposition. The major shortcomings of this technique (e.g. low target utilization and limited sputter yield) could be largely overcome by the introduction of cylindrical magnetrons with rotating target tubes. The use of rotating target tubes introduces various challenges in the domain of sputter hardware development. Adequate solutions for transferring rotational motion, electrical power, and heat, from atmosphere to the water cooled target tube in vacuum are needed. This paper includes the specific magnetron design of the newest end block generation with advanced sealing and power transmission techniques. A new principle for transferring increased mid frequent AC currents is introduced. New sealing techniques are shown for increasing robustness and lifetime of the magnetron. The design requirements of magnetrons for large area display coalers—with the substrate in vertical position—will be explained as well. A cantilevered magnetron with or without supported free end can be an option, dependent of the mounting possibilities in the coater.