首页> 外文会议>Society of Vacuum Coaters Annual Technical Conference; 20050423-28; Denver,CO(US) >A Technique for Measuring the Film Thickness of Ultrathin Metallic Thin Films, 4-20 nm, Using Atomic Force Microscopy
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A Technique for Measuring the Film Thickness of Ultrathin Metallic Thin Films, 4-20 nm, Using Atomic Force Microscopy

机译:利用原子力显微镜测量4-20 nm超薄金属薄膜的膜厚度的技术

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摘要

We describe a technique which allows for atomic force microscopy to be used to make a physical measurement of the thickness of thin film samples. When dealing with a film which is ultrathin ( < 100 nm), standard measurement techniques may become difficult to apply successfully. The technique developed involves the fabrication of a distinct, abrupt step on the film surface, using a device we call the Abruptor. This step can be scanned with an atomic force microscope, revealing the height of the step. Films from 6-15 nm are now routinely measured in this way, though it is possible to apply this measurement technique to thinner and thicker films. The thinnest film we measured was 3.6 nm.
机译:我们描述了一种允许原子力显微镜用于对薄膜样品厚度进行物理测量的技术。当处理超薄(<100 nm)的薄膜时,标准的测量技术可能难以成功应用。开发的技术涉及使用我们称为“ Abruptor”的设备在薄膜表面上制造一个明显的突变步骤。可以使用原子力显微镜扫描此步骤,以显示该步骤的高度。尽管可以将这种测量技术应用于较薄和较厚的膜,但现在通常以这种方式测量6-15 nm的膜。我们测得的最薄薄膜为3.6 nm。

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