Responses of the Cracked Printed-Circuit Boards (PCBs) Subjected to ImpulseShock Loading

摘要

This is a study of the responses of the cracked printed-circuit boards (PCBs). An analytical method for the responsesof the cracked PCBs subjected to impulse shock loading with simply supported boundary conditions is developed by meansof the Galerkin method coupled with integral transform method. Through 3-D plot, deflections and deflection ratios for atypical cracked PCB will be exclusively presented. Results for this analysis are used to draw conclusion regarding theability of relating deflections and deflection ratios to PCB aspect-ratios, to crack-width ratios, to crack-depth ratios, and toforcing period ratios.