Integration and modeling of photonic devices suitable for high performance computing and data center applications

摘要

We report a 200 mm silicon photonic platform integrating a set of devices dedicated on HPC applications. PiN micro-ring modulator layout and process are optimized together. Active tuning through heating section is investigated using either doped silicon or metal resistors. This technology is supported by a dedicated process design kit (PDK) compatible with conventional CMOS EDA tools. The PDK includes optical device models that will be described and compared with experimental results. A focus will be done on the PiN micro-ring modulator models which covering a wide range of geometries. DC mode and RF behaviors are supported.