New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan,RD Center, Zeon Corporation, 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507 Japan;
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan;
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan;
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan;
Graduate School of Engineering, Tohoku University, 6-6-11 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan;
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan,Graduate School of Engineering, Tohoku University, 6-6-11 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579 Japan;
机译:Ga_2中通孔的高刻蚀速率选择性刻蚀的电感耦合Cl_2 / BCl_3等离子体工艺研究
机译:用于在GaN(0001)衬底上制造量子纳米结构的AlGaN / GaN的ECR干蚀刻和选择性MBE生长的研究
机译:高选择性HBr蚀刻工艺用于制造三闸极纳米级SOI-MOSFET
机译:用先进的SIN_X蚀刻气体引入高选择性蚀刻工艺,制造FINFET结构
机译:纳米级处理中的等离子体表面相互作用:通过硅选择性保留低k完整性和高k栅堆叠蚀刻。
机译:NCCL中不同通用粘合剂在蚀刻和冲洗,选择性蚀刻和自蚀刻应用模式下的二十四个月临床表现–一项随机对照临床试验
机译:用于在GaN(0001)衬底上制造量子纳米结构的AlGaN / GaN的ECR干蚀刻和选择性MBE生长的研究
机译:光化学蚀刻的选择性抑制:用于预蚀刻工艺选择的拉曼光谱