首页> 外文会议>Proceedings vol.2005-09; European Conference on Chemical Vapor Deposition(EURCVD-15); 20050905-09; Bochum(DE) >ZIRCONIUM DIOXIDE THIN FILMS FOR high-κ APPLICATIONS BY MOCVD FROM NOVEL MONONUCLEAR PRECURSORS
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ZIRCONIUM DIOXIDE THIN FILMS FOR high-κ APPLICATIONS BY MOCVD FROM NOVEL MONONUCLEAR PRECURSORS

机译:新型单核前驱体MOCVD用于高κ应用的二氧化锆薄膜

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摘要

ZrO_2 thin films with thickness between 2 and 30 rnn were deposited on SiO_x/Si in a multi-wafer planetary MOCVD reactor combined with a liquid delivery system. Two different precursors, Zr(Opr~I)_2(tbaoac)_2 and Zr(Obu~t)2(tbaoac)_2 and two different solvents, n-butylacetate and hexane are used for the deposition. Growth rate, surface roughness, density and crystallization behavior are compared over a wide range of deposition temperatures (400-700℃). Crystallization temperature of films from Zr(Opr~I)_2(tbaoac)_2 was dependent on the choice of the solvent: for hexane it was 50-100℃ higher than for n-butylacetate. Film density similarly depends on deposition temperature and type of solvent, and bulk density of 5.8 gcm~(-3) is reached at high deposition temperature. These differences are correlated with the different carbon incorporation. The electrical properties have been investigated with metal-insulator-semiconductor capacitors. For amorphous films the dielectric constant was around 20 and minimum equivalent oxide thickness obtained was ~2 nm. Compared to SiO_2 low leakage currents were obtained.
机译:在与液体输送系统相结合的多晶片行星式MOCVD反应器中,将厚度为2到30 rnn的ZrO_2薄膜沉积在SiO_x / Si上。两种不同的前体Zr(Opr〜I)_2(tbaoac)_2和Zr(Obu〜t)2(tbaoac)_2和两种不同的溶剂乙酸正丁酯和己烷用于沉积。在较宽的沉积温度范围内(400-700℃)比较了生长速率,表面粗糙度,密度和结晶行为。 Zr(Opr〜I)_2(tbaoac)_2薄膜的结晶温度取决于溶剂的选择:己烷比乙酸正丁酯高50-100℃。膜密度同样取决于沉积温度和溶剂的类型,在高沉积温度下堆积密度达到5.8 gcm〜(-3)。这些差异与不同的碳掺入相关。用金属-绝缘体-半导体电容器研究了电性能。对于非晶膜,介电常数约为20,获得的最小等效氧化物厚度为〜2 nm。与SiO_2相比,获得了低泄漏电流。

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