Thermally Conducting Porous Materials for Cooling of Electronic Components

摘要

The miniaturizations of the electronic components demand new designs for the cooling devices. In our paper we present the research regarding the obtaining of some copper materials having a controlled open isotropic porosity, which can be exploited in the realizing of new cooling devices for electronic components. In this purpose two types of sintered copper porous materials were realized starting from spherical powder particles with sizes included in the range of 120... 100 μm and 90... 71 μm. Samples in form of pipes were made and they were characterized from the physical, thermal, mechanical and microstructural point of view. The samples were then encapsulated in a copper sheet in order to obtain a device that simulates a thermocapilar pump.