Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination

摘要

In this work we present a new manufacturing method for MEMS based multi-level microfluidic devices. The combination of spin-coating SU-8 (MicroChem) and lamination of PerMX dry-photoresist (DuPont) enables the fabrication of a complex 3-level microfluidic channel network with channel aspect ratios ranging from 0.3 up to 3. On 13 mm2 fluidic chip area we realized a complex 3D fluidic network by interconnecting three individual fluidic levels. The unique use of UV-photolithography tools and high-precision UV-lasering for the fluidic chip manufacturing results in 25 µm alignment accuracy between the fluidic levels. We further report on the high material compatibility of SU-8 and PerMX which results in high substrate adhesion of the fluidic devices (26.5 MPa).