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Chemical bevelling and SIMS linescan analysis of low energy boron implanted silicon

机译:化学能斜切和SIMS线可以分析低能硼注入的硅

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摘要

High magnification bevels were produced in samples of low energy boron implanted silicon by chemical etching.Reproducible etching results were obtained for a range of doses for 1 ke V implanted annealed and non-annealed samples.Implant profiles of boron were obtained by linescanning along the bevel and depth calibrating the measurements using light interference surface profiling.The results were found to be in very good agreement with low energy Secondary Ion Mass Spectrometry depth profiles.
机译:通过化学刻蚀在低能硼注入的硅样品中产生高倍率的斜面,对于1 ke V注入的退火和非退火样品,在一定剂量范围内均获得了可再现的刻蚀结果;通过沿斜面进行线扫描获得了硼的注入轮廓结果发现与低能二次离子质谱深度谱非常吻合。

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