Abstract: This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps with strict tolerances - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized. !20
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