Techniques and applications for integrating a semiconductor laser on a micromachined die

摘要

Abstract: This paper describes methods for attaching a verticalcavity surface emitting laser (VCSEL) on to a surfacemicromachined die. Techniques investigated includesilver paste, soldering, wire bonding, and gold padswith integrated resistive heaters. Each technique isevaluated based on reliability, positioning tolerances,and secondary effects. Applications include single chiplaser beam scanning. !10