Quasi amp;#x2014; 3D approach for BGA package thermal modeling

摘要

The quasi-3D BGA package thermal model is proposed. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distribution in different layers of BGA package construction. It is shown that quasi-3D model provides the reasonable accuracy for standard and thermally enhanced BGAs. The software tool OVERHEAT-BGA is developed to obtain an numerical solution with considerably (6–10 times) reduced CPU time in comparison with universal 3D simulators. The good agreement between designed and measured temperatures for standard and XP BGA packages is achieved.