首页> 外文会议>Symposium on Wide Bandgap Cubic Semiconductors: From Growth to Devices >On the Microstructure and the Polytype Transformation in 3C-SiC Crystals Grown by LPE on (001) Substrates at Different Growth Conditions
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On the Microstructure and the Polytype Transformation in 3C-SiC Crystals Grown by LPE on (001) Substrates at Different Growth Conditions

机译:在不同生长条件下(001)底物中的3C-SiC晶体中的微观结构和聚催化转化

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This work focuses on the microstructure of SiC layers grown by liquid phase epitaxy at different temperatures using pure Si or Si with an additive as solvents. 3C-SiC wafers with (001) orientation from HAST Corp. were used as seeds in all cases. The growth temperature was varied in the range of 1650 °C to 1800 °C and three different solvents were compared i.e. pure Si, Si+Al and Si+InP. The structural study revealed that when Al-Si melts were used, several short and long period polytypes, as well as Al inclusions were observed inside the layers. The growth at different temperatures did not affect the overall structural quality but only the type of the observed polytypes. When pure Si and Si+InP melts were used, no polytype transformations were observed. The increase of the temperature slightly improved the density of the defects. In terms of stacking fault density the lowest one (<8x10~3 cm~(-10) was achieved for the liquid phase epitaxy in the Si+InP melt.
机译:这项工作侧重于使用纯Si或Si在不同温度下使用纯Si或Si的液相外延生长的SiC层的微观结构,作为溶剂。来自Hast Corp.的(001)取向的3C-SiC晶片在所有情况下用作种子。在1650℃至1800℃的范围内变化的生长温度变化,并将三种不同的溶剂进行了比较。纯Si,Si + Al和Si + InP。结构研究表明,当使用Al-Si熔化时,在层内观察到几个短期和长期的多型,以及Al夹杂物。不同温度的增长不会影响整体结构质量,而只是观察到的多型的类型。当使用纯Si和Si + InP熔体时,没有观察到多型转化。温度的增加略微提高了缺陷的密度。就堆叠故障密度而言,对于Si + InP熔体中的液相外延,实现了最低的1(<8×10〜3cm〜(-10)。

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