Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in plane Lapping Process

摘要

This paper analyses the kinetic trajectory of abrasives both in initiative driving mode and passive driving mode, and the uniformity of lapping trajectory of the two opposite drive modes is discussed, respectively. The imperative relation between the kinematic trajectory and the uniformity is researched in this paper, as well as the simulation of the lapping trajectory.