首页> 外文会议>Chinese Materialsonference >Effect of Process Parameters on the Interface Microstructure and Thickness of Silver Cladding Copper Wires Prepared by Core-Cladding Continuous Casting
【24h】

Effect of Process Parameters on the Interface Microstructure and Thickness of Silver Cladding Copper Wires Prepared by Core-Cladding Continuous Casting

机译:工艺参数对芯包层连续铸造制备的银覆层铜线界面微观结构和厚度的影响

获取原文

摘要

Liquid silver and solid copper with diameter of 8 mm were used as raw materials, and the silver cladding copper (SCC) wires with a diameter of 10 mm were prepared by the self-developed core-cladding continues casting (CCC) method at the silver casting temperature of 1000-1100°C, casting speed of 30-90 mm min~(-1), cooling water temperature of 20°C and cooling water flow of 300 L h~(-1). The microstructure and morphology, distribution of chemical components, and phase composition of the interface between Ag and Cu were characterized by optical microscope (OM), field emission scanning electron microscope (FESEM), and energy dispersive spectrometer (EDS). The effect of the silver casting temperature and casting speed on the interface microstructure and thickness of silver cladding copper wires and formation mechanism of the interface were investigated. The results showed that the interface microstructure which from the surface to the Cu core of the silver cladding copper wire was Ag (Cu) solid solution, hypoeutectic, eutectic and Cu (Ag) solid solution when the silver casting temperature was 1050°C and casting speed was 30-60 mm min~(-1). And the interface microstructure which from the surface to the Cu core of the silver cladding copper wire was Ag (Cu) solid solution, eutectic and Cu (Ag) solid solution when the casting speed increase to 90 mm min~(-1) and the silver casting temperature was 1000-1050°C. The interface microstructure which from the surface to the Cu core of the silver cladding copper wire is all hypereutectic, when the silver casting temperature was 1100°C, casting speed was 90 mm min~(-1). With the increase of the casting speed, the thickness of the interface transition layer decreased sharply, the thickness of the hypoeutectic layer and Ag (Cu) solid solution layer decreased, and the eutectic layer thickness increased first and then decreased, but the thickness of Cu (Ag) solid solution remained almost constant. Under the condition of low casting temperature and high casting speed, core-cladding continues casting technology is advantageous to prepare the bimetallic composite material which is prone to eutectic reaction.
机译:用直径为8mm的液体银和固体铜用作原料,并且通过在银中的自发裂的芯衬垫继续浇铸(CCC)方法,制备直径为10mm的银覆铜(SCC)线铸造温度为1000-1100°C,铸造速度为30-90 mm min〜(-1),冷却水温度为20°C和冷却水流300L h〜(-1)。通过光学显微镜(OM),现场发射扫描电子显微镜(FESEM)和能量分散光谱仪(EDS)的显微结构和形态,化学成分的分布和Cu的相位组成的特征。研究了银浇铸温度和铸造速度对界面界面微观结构和界面的界面厚度的影响。结果表明,当银铸造温度为1050℃并铸造时,从银覆层铜线的表面与银覆铜线的表面微观溶液,红涂层,共析和Cu(Ag)固溶体速度为30-60毫米分钟〜(-1)。并且从银覆层的表面到Cu芯的界面微观结构是Ag(Cu)固溶溶液,共晶和Cu(Ag)固溶溶液,当浇铸速度增加至90mm min〜(-1)和银铸造温度为1000-1050°C。从银覆层铜线的表面到Cu芯的界面微观结构是所有过度化的,当银铸造温度为1100℃时,铸造速度为90mm min〜(-1)。随着铸造速度的增加,界面过渡层的厚度急剧下降,低屈光层和Ag(Cu)固溶体层的厚度降低,并且共晶层厚度先增加,然后减少,但Cu的厚度(Ag)固溶仍然几乎恒定。在低铸造温度和高铸造速度的条件下,芯覆层继续铸造技术是有利的,该技术是制备易于共晶反应的双金属复合材料。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号