Integrating Microscopic Analysis into Existing Quality Assurance Processes

摘要

When technical goods, like mainboards and other electronic components, are produced, quality assurance (QA) is very important. To achieve this goal, different optical microscopes can be used to analyze a variety of specimen to gain comprehensive information by combining the acquired sensor data. In many industrial processes, cameras are used to examine these technical goods. Those cameras can analyze complete boards at once and offer a high level of accuracy when used for completeness checks. When small defects, e.g. soldered points, need to be examined in detail, those wide area cameras are limited. Microscopes with large magnification need to be used to analyze those critical areas. But microscopes alone cannot fulfill this task within a limited time schedule, because microscopic analysis of complete motherboards of a certain size is time demanding. Microscopes are limited concerning their depth of field and depth of focus, which is why additional components like XY moving tables need to be used to examine the complete surface. Yet today's industrial production quality standards require a 100 % control of the soldered components within a given time schedule. This level of quality, while keeping inspection time low, can only be achieved when combining multiple inspection devices in an optimized manner. This paper presents results and methods of combining industrial cameras with microscopy instrumenting a classi-ficatory based approach intending to keep already deployed QA processes in place but extending them with the purpose of increasing the quality level of the produced technical goods while maintaining high throughput.