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Combination of Digital Speckle Pattern Interferometry and Digital Image Correlation for 3-D Deformation Measurement

机译:三维变形测量的数字散斑图案干涉测量和数字图像相关性的组合

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This paper refers to two whole-field, non-contact experimental techniques: Digital Speckle Pattern Interferometry (DSPI) and Digital Image Correlation (DIC). The former can measure 3-D deformations in nanometric level. The latter can measure small displacement in micrometric level. DSPI needs a phase-shifting setup and rotating the whole device for 3-D deformation measurement. Two CCD cameras will be required recording speckle image simultaneously for 3-D measurement by DIC method. An optical system which is a combination of the two measurement method is proposed in this paper. Digital image correlation setup using one CCD camera for in-plane measurement and digital speckle pattern interferometric setup for outplane measurement constitutes this measurement system. Three dimensions information of deformation can be recorded simultaneously by one 3-color CCD camera. This system can be used to measure deformation with a small out-plane component and a relatively larger in-plane component.
机译:本文是指两个全场,非接触式实验技术:数字斑点图案干涉测量法(DSPI)和数字图像相关(DIC)。前者可以测量纳米级的3-D变形。后者可以测量微米水平的小位移。 DSPI需要相移设置并旋转整个设备以进行3-D变形测量。将需要两个CCD摄像头,通过DIC方法同时记录散斑图像以进行3-D测量。本文提出了一种是两种测量方法的组合的光学系统。数字图像相关设置使用一个用于面内测量的CCD摄像机和用于外部测量的平面测量和数字斑点图案干涉设置构成该测量系统。可以通过一个3色CCD相机同时记录变形的三维信息。该系统可用于测量用小外平面分量和相对较大的面内分量的变形。

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