2012 Industry Survey Results: Underfill Challenges for High Volume Manufacturing - (PPT)

摘要

2012 Industry Survey Results: 1. Industry is highly interested in 3DI technology (by necessity) with key players in R/D to small volume manufacturing phases of product development lifecycle 2. Technical challenges of underfill include: 3DI products' features are now driving the challenges, vertically with die stacking levels, horizontally with gap-filling capability, thermally with required power consumption; Gap-filling process will require x3 improvement to address geometrical needs; Material thermal conductivity will require at least x2 improvement to address thermal needs. 3. Gaps study outcomes include: Throughput for established capillary underfill process and thin wafer/die handling dominate cost concerns; Process performance immaturities as well as yield are concerns for pre-applied underfill; Thermal conductivity is strongly bipolar per application needs.