DIFFUSION BONDING OF Al7075 TO Ti-6Al-4V USING EUTECTIC FORMING INTERLAYERS

摘要

Two dissimilar aerospace alloys Ti-6Al-4V and Al7075 were diffusion bonded using a zinc coatings and copper interlayers. The eutectic reactions of Al-Zn and Al-Cu were used to produce bonds between the titanium and aluminum alloys. The scanning electron microscopy (SEM) and Energy Dispersive X-ray (EDX) analysis showed that at longer bonding times, the formations of brittle microstructures such as zinc oxide and aluminum oxide dominate the joint region when bonding with zinc coatings. The diffusion bonds formed using copper interlayers have showed better results within a more uniform hardness profile across the bonded interface.