Modification of Resin and its Application to Resin-bonded Diamond Wire Saw Manufacture

摘要

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2 mm), the modified resin and the diamond abrasive (the diameter is 20～30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.