The human body is quite possibly the harshest and most complex environment known for microelectronic / micromechanical assemblies. Medical device assemblies are decreasing in size to provide access and comfort for extracorporeal and in situ devices. In addition the scale of electronic components will continue to consistently become smaller and denser with the advances and improvements in technology. Packaging and assembling these devices is requiring a much higher level of precision than ever before, whether conformal coating for environmental protection or dispensing medical adhesive for assembly. Non-contact jetting of conformal coating as well as semiconductor packaging fluids represents a paradigm shift to a higher level of precision in the method of applying coatings and adhesives versus traditional dispensing methods. This paper will cover the advancements in manufacturing methods for high precision environmental coating and adhesive dispensing. Dispensing of material for medical devices can be primarily divided into two major sub sections; conformal coating and adhesives. Conformal coating is essential to a medical devices sustainability and compatibility. Typically a biocompatible material is applied to the device to act as a protection barrier against the environment; if the device is not coated could result in complete failure. One of the oldest and best-known methods of coating is the dip process. In the manual dip operation, operators immerse the PCB in a tank of coating. Components on the PCB that cannot be exposed to coating must first be masked.
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