3D packaging for space application: imagination and reality

摘要

This paper describes the ALCATEL experience on the design, manufacturing and measurement of microwave and digital modules based on 3D packaging approach. Even if that appears as a very futuristic approach today, this could represent a packaging option for the next space equipment generation by the years 2015-2025. This implies to move from current hermetic encapsulation of active devices to advanced technologies such chip on board, including glob top encapsulation. The paper then describes the design and manufacture of a low noise amplifier section based on this quasi hermetic packaging option. This chip on board approach is a real candidate for equipment by the years 2007-2015.