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LEAD FREE WAVE SOLDERING AT ITS BEST

机译:铅免波焊接在最佳状态下

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摘要

The wave soldering process is one of the processes that is most impacted by the introduction of lead free materials. There are a number of factors to consider when optimizing the wave soldering process (flux type and application methods, preheat temperature, conveyor speed, solder pot temperature, board immersion depth, etc.). How does the introduction of lead free materials impact the wave solder process factors and wave soldering equipment itself? Figure 1 This article will explore the wave solder machine for the best combination of fluxer, preheat and wave configuration that will yield the optimum results in lead free soldering. In addition to the machine configuration the process parameters will be discussed as to establishing a robust process for lead free wave soldering. Solder alloy type, printed circuit board finish, and flux type will also be discussed in general as to what effect they have on the process and what is recommended for lead free.
机译:波峰焊接过程是通过引入无铅材料影响的过程之一。优化波焊过程(助焊剂型和应用方法,预热,输送机速度,焊接罐温度,板浸没深度等时,有许多因素考虑。导铅材料的引入如何影响波焊接处理因素和波焊设备本身?图1本文将探讨波焊机,以实现助势,预热和波形配置的最佳组合,从而产生铅免焊接的最佳结果。除了机器配置之外,将讨论过程参数,以建立无铅波焊的鲁棒过程。焊料合金类型,印刷电路板饰面和助焊剂类型也将讨论它们对过程的影响以及建议无铅的效果。

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