DEVELOPMENT OF MULTILAYER FLEX SUBSTRATE WITH LIQUID CRYSTAL POLYMER FILM

摘要

In accordance with prevalence of wireless Local Area Network (LAN) and electrical mobile devices such as cellular phones, Personal Digital Assistants (PDA) and notebook personal computers, massive and fast data transmission for handling sound and pictures is being required in small body size of a semiconductor package. In the evolution, substrates for packages also become smaller and thinner, accommodating more I/O terminals with appropriate electrical properties.[1] In this paper, the possibility of highly dense, reliable substrate with Liquid Crystal Polymer (LCP) material is discussed. And electrical properties in high frequency are compared with conventional substrate.