首页> 外文会议>Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging >H.A.L.T. TEST VEHICLE FOR LEAD FREE SURFACE FINISH AND SOLDER PASTE SELECTION
【24h】

H.A.L.T. TEST VEHICLE FOR LEAD FREE SURFACE FINISH AND SOLDER PASTE SELECTION

机译:停止。用于无铅表面光洁度的试验载体和焊膏选择

获取原文
获取外文期刊封面目录资料

摘要

Thomson has developed a test vehicle and protocol to enable our engineers and management decision makers to easily measure and compare the often elusive, interactions between surface finish, paste flux and solder alloy. This thermo-mechanical test method measures the average energy required to fracture SMT solder joints using nine, (9) different strain conditions. The ease of replication and simple test geometry allows practical multifactor experiments to be conducted on paste alloys and their flux vehicle. The method permits measurement of thermal stability, packaging and shelf life studies on PCB finishes and allows measurement of their complex interaction with paste alloys, I.e. wetting, fillet formation, intermetallic phases distribution and, alloy dilution. Data presented in this paper has expanded upon our earlier work now including evaluation of multiple suppliers of Immersion silver & tin coatings, OSP, ENIG and Lead free HASL. Additional reliability data on 3% & 4% SAC alloy is presented along with comparisons to non silver bearing paste alloys; SnCuNi and SnZn.
机译:Thomson开发了一种测试车辆和协议,使我们的工程师和管理决策者能够轻松测量和比较表面光洁度,粘贴通量和焊料合金之间的经常难以捉摸的相互作用。该热机械测试方法测量使用九种(9)不同的应变条件折断SMT焊点所需的平均能量。复制和简单的测试几何形状的易于复制允许在糊状合金及其助焊剂车上进行实际的多应别实验。该方法允许测量PCB饰面的热稳定性,包装和保质期研究,并允许测量与糊状合金的复杂相互作用,即润湿,圆角形成,金属间相分布和合金稀释。本文提出的数据在我们之前的工作中扩展了现在,包括对浸入银和锡涂料,OSP,ENIG和无铅HASL的多个供应商的评估。在3%和4%SAC合金上的额外可靠性数据以及非银轴承粘贴合金的比较呈现出来; sncuni和snzn。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号