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Printed Circuit Board Assembly in a High Mix Electronics Manufacturing Environment

机译:印刷电路板组件在高混合电子制造环境中

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The electronics industry is undergoing significant changes in its manufacturing structure. These changes include the 'outsourcing' of production to Electronics Manufacturing Service (EMS) providers by Original Equipment Manufacturers (OEMs). The increasing use of EMS providers has placed new constraints on EMS providers establishing manufacturing standards to respond fast and accurately to OEM requests. This market is characterized by high consumer expectations and demands, globalization, and tough competition. The key to success in the market for the electronics manufacturing industry has become "manufacturing efficiency". This situation is driven by the commoditization of electronic products. The issue is no longer quality and reliability―these are assumed. Maximizing manufacturing efficiency requires a change in thinking from "yield improvement" to "time to asymptotic yield". The current strategy must expand to include crosscutting technologies. Modeling and design for X (Design for Excellence or DFX), factory information systems (FIS), test, environmental consciousness and supply chain management are emerging as the more significant arenas in which competitive advantage must be achieved. High-mix, low-volume manufacturing is the most challenging manufacturing environment emerging today. The most significant reasons forcing many EMS providers to adopt the high-mix, low volume manufacturing environment includes mass customization, shrinking inventories, decreasing time-to-market, and shorter product life cycles. The evolution of high-mix, low volume manufacturing environments has evoked many challenges to the EMS providers to manufacture products with high yield. Some of the manufacturing challenges EMS providers face include product changeover, machine utilization, product setup, high component mix, varying board sizes, build-to-order and yield improvement. This paper is an effort to discuss some of the issues faced by a high-mix, low volume-manufacturing environment and approaches that could help them to compete in the business. This paper also discusses current technologies that could help to establish an effective and efficient manufacturing operations model, critical to profitably meeting the responsiveness and delivery performance challenges of a dynamic agile, high-mix, low-volume electronics manufacturing environment.
机译:电子行业正在经历其制造结构显著的变化。这些变化包括生产电子制造服务(EMS)供应商的原始设备制造商(OEM)的“外包”。越来越多地使用EMS供应商已对EMS供应商建立生产标准,以快速响应和准确地向OEM要求新的限制。这个市场的特点是高的消费者的期望和要求,全球化和激烈的竞争。对于电子制造行业成功的关键在市场上已经成为“生产效率”。这种情况是由电子产品的商品化驱动。这个问题已不再是质量和可靠性,这些假设。最大限度地提高生产效率,需要从“提高产量”,以“时间渐近产量”思想的变化。目前的战略必须扩大到包括横切技术。建模和设计为X(设计优秀或DFX),工厂信息系统(FIS),测试环境意识和供应链管理正在成为其竞争优势,必须实现更显著领域。高混合,小批量生产是最有挑战性的制造环境今天出现。迫使许多EMS提供商采用高混合最显著的原因,小批量制造环境包括大规模定制,库存萎缩,减少时间到市场,产品生命周期缩短。高混合,低批量制造环境的演变引起的EMS供应商面临许多挑战能够制造出高产量。一些制造的挑战EMS提供商面包括产品转换,机器利用率,产品设置,高组分混合物,不同板尺寸,生成按订单和产量的提高。本文是为了讨论所面临的一些高混合,小批量,生产环境中的问题和方法,可以帮助他们在商业竞争。本文还讨论了当前的技术,可以帮助建立一个有效和高效的生产运营模式,盈利性满足动态灵活,高混合,小批量电子制造业环境的反应能力和交付能力挑战的关键。

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