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DRAMATIC IMPROVEMENTS IN ALGAN/GAN HEMT DEVICE ISOLATION CHARACTERISTICS AFTER UV-OZONE PRE-TREATMENT

机译:UV-Ozone预处理后Algan / GAN HEMT设备隔离特性中的剧烈改进

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摘要

A UV-Ozone pre-treatment method of passivation prompted by degradation of AlGaN/GaN HEMT device isolation characteristics after SiNx passivation was conducted and analyzed. Without pre-treatment, breakdown voltages were found to drop from 60V (the test maximum) to ~5 V, and inter-device isolation current was found to increase from 10 to 10~(-6) A following PECVD SiN_x passivation. With pre-treatment, breakdown voltages were found to drop from 60 V to ~58 V, and inter-device isolation current was found to increase from 10~(-9) to ~10~(-8) A following PECVD SiN_x passivation. TEM and XPS measurements were taken to determine the nature of the UV-Ozone treatment, and DC/RF results were analyzed to determine effectiveness of UV-ozone pre-treated passivation versus standard SiN_x passivation.
机译:进行了SiNx钝化后,由于AlGaN / GaN HEMT器件隔离特性降低而导致的钝化的UV-臭氧预处理方法。如果不进行预处理,发现击穿电压从60V(测试最大值)下降到〜5V,并且器件间隔离电流在PECVD SiN_x钝化之后从10增加到10〜(-6)A。经过预处理,发现PECVD SiN_x钝化后,击穿电压从60 V下降至〜58 V,并且器件间隔离电流从10〜(-9)增加至〜10〜(-8)A。进行TEM和XPS测量以确定UV-臭氧处理的性质,并分析DC / RF结果以确定UV-臭氧预处理的钝化与标准SiN_x钝化的有效性。

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