Application of Novel Ultrasonic Cleaning Equipment Using Waveguide Mode for Single-Wafer Cleaning Process

摘要

The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.