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Micromachined VO{sub}2-based uncooled IR bolometric detector arrays with integrated CMOS readout electronics

机译:基于MicroChined VO {Sub} 2的未冷却IR电压探测器阵列,具有集成的CMOS读数电子器件

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Uncooled IR bolometric detectors fabricated using surface silicon micromachining are presented. The detector fabrication process employs a polyimide sacrificial layer, and a VO{sub}2 thermistor layer exhibiting a thermal coefficient of resistance on the order of -3 %/°C. Detector sizes are 100 μm× 100 μm and 50 μm×50μm and 64 × 64 and 128 × 128 pixel arrays are fabricated. The detectors exhibit responsivities of up to 15 000 VW{sup}(-1), normalized detectivities typically exceeding 10{sup}8 cm Hz{sup}(1/2)W{sub}(-1) and response times below 20 ms. Three integrated readout circuit designs for 64 × 64 and 128 × 128 pixel detector arrays, fabricated using a standard 1.5 μm CMOS process, are described. These circuits include several test and detector nonuniformity correction features and can operate in either self scanning mode at a rate of 30 frames per second, or in the random access mode in which column and row addresses are input directly.
机译:提出了使用表面硅微机械制造的未冷却的IR探测器。检测器制造工艺采用聚酰亚胺牺牲层,并且VO {亚} 2热敏电阻层,其呈现的热量系数为-3%/℃。检测器尺寸为100μm×100μm,制造50μm×50μm,64×64和128×128像素阵列。检测器表现出高达15000VW {sup}( - 1)的响应,归一化探测通常超过10 {sup} 8cm hz {sup}(1/2)w}( - 1),并低于20的响应时间多发性硬化症。描述了使用标准的1.5μmCMOS工艺制造的64×64和128×128像素探测器阵列的三个集成读出电路设计。这些电路包括多个测试和检测器不均匀性校正特征,并且可以以每秒30帧的速率或在直接输入列和行地址的随机访问模式下以自扫描模式操作。

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