Mold compounds which are used for plastic encapsulated integrated circuits have the ability to absorbe and to store humidity originated from the ambient environment. During the soldering process for printed circuit board assembly, the stored humidity will be vapourized and can create an internal pressure. This pressure may cause cracks in the mold compound and / or delaminations at the interface between die, lead frame, die paddle and mold compound. The cracks and delaminations could lead to corrosion on the die Surface or broken bond wires due to mechanical forces during temperature change resulting in a reduced lifetime of the component.
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