Temporary Bonding Cost Of Ownership: The link between total thickness variation and chip yield - (PPT)

机译：临时绑定所有权成本：总厚度变化与芯片产量之间的联系 - （PPT）

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Temporary Bonding and Debonding maturity and cost-of-ownership made significant improvement steps in all categories: 1. HVM equipment Platform; Dedicated high volume manufacturing Platform, Improved throughput, performance & Maturity, In-line metrology and yield management, Total Thickness Variation (TTV); Dow Corning temporary bonding adhesives show capability of post grinding TTVs well below 2μm, Integration; Higher end integration schemes lead to significant cost reduction for overall temporary bonding and debonding process.

机译：临时债券和剥夺成熟度和所有权成本在所有类别中取得了重大改进步骤：1。HVM设备平台;专用高批量生产平台，提高吞吐量，性能和成熟，在线计量和产量管理，总厚度变化（TTV）;道康宁临时粘接粘合剂显示出磨削TTV的能力远低于2μm，整合;对于整体临时债券和剥离过程，更高的整合方案导致大量成本降低。

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《IMAPS International Conference and Exhibition on Device Packaging》|2014年||共20页
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A. Peic; T. Uhrmann; J. Burggraf; H. Wiesbauer; J. Bravin; T. Matthias; M. Wimplinger; P. Lindner; H. Meynen; Y. Civale;
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Temporary Bonding Cost Of Ownership: The link between total thickness variation and chip yield - (PPT)

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