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Effect of Input Structure of Blank on Development of Final Structure when Processing at Temperatures Between Solidus and Liquidus

机译:空白投入结构对固体和液体温度的处理时终结开发的影响

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The article describes the effect of input material structure on the structure development during the subsequent processing by mini-thixoforming technology. Two different initial states were prepared from X210Crl2 tool steel for the experiment. The first semi-product was used in the soft-annealed state with ferritic-carbidic microstructure and coarse primary chromium carbides. Ferritic grain size 13,7 μm and the hardness was 210 HV30. The second state was prepared by high temperature annealing at 1200°C for 1 hour. The microstructure then consisted of austenite and carbides. The grain size was in the range of cca 37 to 50 um, hardness was 300 HV30. Treatment consisted of heating to a semi-solid state at the temperature 1265°C in 9 s. That was followed by direct cooling to room temperature in 2 s. The grain size and distribution of eutectic in the volume of the processed material were selected as the attributes for microstructure evaluation after mini-thixoforming. The structure after processing in a semi-solid state consists of polyhedral austenite with a grain size of 43-59 μm, compared to the initial range 37-50 μm. This compares to the soft annealed state when, after semi-solid processing, the grain size was only 10 to 13 microns.
机译:本文介绍了输入材料结构对迷你触发技术后续处理期间的结构开发的影响。两种不同的初始状态是由X210CRL2工具钢制备用于实验的。第一个半产物用于软退火状态,具有铁素体 - 碳基微观结构和粗致铬碳化物。铁素体晶粒尺寸为13,7μm,硬度为210hv30。通过在1200℃下的高温退火制备第二种状态1小时。随后的微观结构由奥氏体和碳化物组成。晶粒尺寸在CCA 37至50μm的范围内,硬度为300 HV30。处理包括在9秒内1265℃的温度下加热到半固态。然后在2秒内直接冷却至室温。选择在加工材料的体积中共晶的晶粒尺寸和分布作为微观触变后微观结构评估的属性。与初始范围37-50μm相比,半固态处理后的结构由晶粒尺寸为43-59μm的多面体奥氏体组成。这与软退火状态相比,在半固体加工后,晶粒尺寸仅为10至13微米。

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