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GaAs Metal-Oxide-Semiconductor Based Non-volatile Flash Memory Devices with InAs Quantum Dots As Charge Storage Nodes

机译:GaAs金属 - 氧化物 - 半导体基于非易失性闪存装置,具有INAS量子点作为电荷存储节点

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Ultra-thin InP passivated GaAs metal-oxide-semiconductor based non-volatile flash memory devices were fabricated using InAs quantum dots (QDs) as charge storing elements by metal organic chemical vapor deposition technique to study the efficacy of the QDs as charge storage elements. The grown QDs were embedded between two high-k dielectric such as HfO_2 and ZrO_2, which were used for tunneling and control oxide layers, respectively. The size and density of the QDs were found to be 5 nm and 1.8×10~(11) cm~(-2), respectively. The device with a structure Metal/ZrO_2/InAs QDs/HfO_2/GaAs/Metal shows maximum memory window equivalent to 6.87 V. The device also exhibits low leakage current density of the order of 10~(-6) A/cm~2 and reasonably good charge retention characteristics. The low value of leakage current in the fabricated memory device is attributed to the Coulomb blockade effect influenced by quantum confinement as well as reduction of interface trap states by ultra-thin InP passivation on GaAs prior to HfO_2 deposition.
机译:超薄InP钝化的GaAs金属氧化物 - 半导体基于基于的非易失性闪存器件,使用INAS量子点(QDS)作为电荷存储元件通过金属有机化学气相沉积技术研究QDS作为电荷存储元件的功效。生长的QD分别嵌入两个高k电介质之间,例如HFO_2和ZrO_2,其分别用于隧道和控制氧化物层。发现QD的尺寸和密度分别为5nm和1.8×10〜(11)cm〜(-2)。具有结构金属/ ZRO_2 / INAS QDS / HFO_2 / GAAS / METAL的装置显示了相当于6.87 V的最大内存窗口。该器件还表现出低漏电流密度为10〜( - 6)A / cm〜2和相当良好的充电保留特征。制造的存储器装置中的漏电流的低值归因于由量子限制影响的库仑封锁效应以及通过在HFO_2沉积之前通过超薄INP钝化来减少接口捕集状态。

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