In order to satisfy the requirements of high power devices, a novel spray cooling system integrated in the refrigeration circuit is proposed and its performance is investigated experimentally. The heat transfer coefficient up to 35000 W/(m~2K) can be achieved when the nozzle inlet pressure and the chamber pressure are 0.33MPa and 0.19MPa respectively. The surface temperature can be kept at 35°C with the heat flux of 108 W/cm~2, and the standard deviation of the surface temperature is within 3°C when the heat flux is raised up to 125 W/cm~2. The system has simple structure and can easily adjust the pressure, making it a good cooling solution for high power devices. The novel spray cooling system can meet the heat removal requirements for most electronic devices in actual applications and therefore good prospect is expected.
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