首页> 外文会议>International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing >THE APPLICATION OF SURFACE ANALYSIS TECHNIQUES FOR MONITORING HYDROGEN TERMINATION CLEANING PROCESSES
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THE APPLICATION OF SURFACE ANALYSIS TECHNIQUES FOR MONITORING HYDROGEN TERMINATION CLEANING PROCESSES

机译:表面分析技术在监测氢终止清洗过程中的应用

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摘要

The applications of attenuated total reflection-Fourier transform infrared spectroscopy, spectroscopic ellipsometry, surface wetting, and ion beam techniques for monitoring processes used to create hydrogen-terminated silicon (100) surfaces are discussed. A technique for preserving H-passivated surfaces during transport is described. Different HF/alcohol oxide etch solutions and alcohol rinses were compared to standard HF/H{sub}2O cleans. Aqueous HF and HF/methanol solutions provided the most hydrogen termination. Ethanol and isopropyl alcohol rinses reduced adsorbed water and organic contamination during wafer transport. A new accessory was used to perform infrared spectroscopy on whole silicon wafers.
机译:讨论了衰减总反射 - 傅里叶变换红外光谱,光谱椭圆形,表面润湿和离子束技术的应用,用于监测用于产生氢封端的硅(100)表面的过程。描述了一种用于在运输过程中保持H钝化表面的技术。将不同的HF /酒精氧化物蚀刻溶液和醇冲洗与标准HF / H {Sub} 2o进行比较。 HF和HF /甲醇溶液提供最多的氢终止。乙醇和异丙醇润滑液在晶片运输过程中减少吸附的水和有机污染。使用新的配件在整个硅晶片上进行红外光谱。

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