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Metallurgical Interface of 7075/6061 Bimetallic Composite Ingot Casted by Semi-Solid Slurry and Molten Metal Pouring

机译:7075/6061冶金界面7075/6061通过半固体浆料和熔融金属浇注铸造的双金属复合锭

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The 7075/6061 bimetallic composite ingots were prepared by semi-solid/liquid method. The microstructure characteristics of composite ingots were studied, and the diffusion law of interface components was analyzed. The results show that the semi-solid/liquid composite of 7075 and 6061 can be realized under the conditions of casting temperature of 983 K, semi-solid heating temperature of 918 K, holding time of 1h, and rapid water cooling. The obtained composite ingot has a layered distribution characteristic of "semi-solid microstructure/dendritic structure". The interface is clear, continuous, and free of impurities. From the interface to the semi-solid side, it shows such a pattern of change: "Dendritic structure" → "Semidendritic and hemispherical" → "Globularization". Through the observation of the microstructure and the analysis of the components, the semi-solid/liquid composite mechanism is discovered to be a combination of fusion bonding and diffusion bonding.
机译:通过半固体/液体方法制备7075/6061双金属复合锭。研究了复合锭的微观结构特征,分析了界面组分的扩散规律。结果表明,7075和6061的半固体/液体复合材料可以在983 k,半固体加热温度为918K,保持时间为1H的时间和快速水冷却的条件下实现。所得复合锭具有“半固体微观结构/树枝状结构”的分层分布特性。该界面清晰,连续,不含杂质。从界面到半固体方面,它显示了这种变化模式:“树突结构”→“半球形和半球形”→“球状化”。通过观察组分的微观结构和分析,发现半固体/液体复合机构是融合键合和扩散键合的组合。

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