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The Application of a Type of Electric Pastern in the Bonding Technique of the Microcircuit Board

机译:一种在微电路板粘接技术中的一种电动Pastern的应用

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The authors have performed experiments in the felting of electric pasterns upon the samples of aluminum alloy boards,gold-plating boards and glass strips, the method of which is to first felt 2 microcircuit boards with electric pastern and fix them with some mechanical devices, then keep them in the drying blast oven for 4 hours with a constant temperature of 150+2°C and finally, cool them naturally to the ambient temperature. The series of experiments made include the testing of the extension and cutting intensity of the electric pastern, the testing of the volume resistivity of the electric pastern and the experiment of the concussion given to the electric pastern at relatively high or low temperatures, the purpose of which is to test the reliability of its felting quality and further to study the application of the electric pastern in the bonding technique of the microcircuit board. Obtained from the testing of extension intensity carried out with the relevant testing machine according to GB7124- 86, the testing value of aluminum alloy board is between 5.5M Pa and 6.99 M pa, the testing value of the gold-plating board is from 2.45M Pa to 3.07M Pa, which clearly mean that the joining intensity of electric pastern to aluminum alloy board is better than that to the gold-plating board. However, both intensities have met our demands and are acceptable. We also have tested the volume resistivity of the glass strips connected to it. Since for the bonding technique of the microcircuit board, it is usually acceptable if the resistivity of the electric pastern is less than 9.0× 10-4 Q.cm, our testing data have shown that the quality of this type of electric pastern is satisfactory. Having fulfilled the concussion test for the microcircuit board at relatively high or low temperatures, we have tested the reliability of the bonding points. The finding shows that the change of the resistivity of the microcircuit board is within very small scale, and if assigned to every felting point, the change can simply be ignored, thus cannot affect the felting quality at all. To sum up, the series of experiments have given the proof that this type of electric pastern meets the requirements of the bonding technique of the microcircuit board connected by gold threads or gold bands.
机译:作者对铝合金板的样品,镀金板和玻璃条的样品进行了电气Pasters的电气,其方法是首先觉得用电动Pastern毛毡2个微电路板,并用一些机械装置固定它们将它们保持在干燥喷砂炉中,恒温为150 + 2°C,最后,自然地冷却到环境温度。制成的一系列实验包括测试电动Pastern的延伸和切割强度,电动Pastern的体积电阻率的测试以及给予电动Pastern的肠道的实验,在相对高或低温下,目的这是为了测试其毡合质量的可靠性,进一步研究电动Pastern在微电路板的粘接技术中的应用。根据GB7124-86的相关试验机进行的延长强度的测试获得,铝合金板的测试值在5.5M PA和6.99 M PA之间,镀金板的测试值为2.45米PA至3.07米PA,这显然是指电铝合金板的连接强度优于镀金板。然而,两个强度都达到了我们的要求,并且是可接受的。我们还测试了连接到它的玻璃条的体积电阻率。由于对于微电路板的粘接技术,通常可以接受,如果电动Pastern的电阻率小于9.0×10-4 Q.cm,我们的测试数据表明这种类型的电动Pastern的质量令人满意。在相对高或低温下满足了微电路板的脑震荡测试,我们测试了粘合点的可靠性。该发现表明,微电路板的电阻率的变化在非常小的尺寸范围内,如果分配给每个毡尖点,则可以简单地忽略变化,因此根本不能影响毡合质量。总而言之,一系列实验已经证明这种类型的电动PASENT符合金螺纹或金带连接的微电路板的粘接技术的要求。

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