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Low Cost Optoelectronic Packages: Development of a Fast Alignment Technique and a Stable Bonding Process for Singlemode Optical Fibers

机译:低成本光电包装:开发快速对准技术和单模光纤的稳定粘接工艺

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Optical fiber alignment and fixing processes are still today the most critical and cost intensive steps in the manufacturing of optoelectronic modules. With standard coarse alignment scanning routines, the optical fiber alignment time can be as large as 5 to 10 minutes. Here, using a combination of pattern recognition for the coarse alignment and fine alignment algorithms, we have reduced the fiber alignment time to less than 90 s. Once properly aligned, the fiber fixing technique must maintain the required positioning accuracy over time. In this work, we have developed an adhesive bonding process to fix an optical fiber on a laser carrier. A fiber offset was introduced to compensate for the adhesive shrinkage upon polymerization. The assembly can withstand pull load over 2 kg and thermal cycling between 25°C and 80°C over one week without degradation of the optical coupling efficiency.
机译:光纤对准和固定过程仍然是光电模块制造中最关键且成本的强化步骤。通过标准粗校准扫描程序,光纤对准时间可以大至5至10分钟。这里,使用用于粗对对准和精细对准算法的模式识别的组合,我们将光纤对准时间降低至小于90秒。一旦适当对齐,光纤固定技术必须随时间保持所需的定位精度。在这项工作中,我们开发了一种粘合剂粘合过程,以固定在激光载体上的光纤。引入纤维偏移以补偿聚合时粘合剂收缩。该组件可以承受超过2kg的拉载荷,并且在一周内在25°C和80°C之间进行热循环,而不会降低光学耦合效率。

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