TESTS ON THE THERMAL STRESS INDUCED WARPING EFFECTS IN THE POLYSILICON SOLAR CELLS/PANELS

摘要

This study aims at reducing or eliminating the residual deformation of the photovoltaic solar cell/panel thin sheets from the fabrication assemble lines. The warping deformation is mainly introduced by the poly silicon sheet itself due to the heating and cooling process and uniformly the shrinking effect of the bonding interface between silver paste and sheet. The measurement on the out-plane deformation by the method of optical gratings and that of the in-plane direction is by the EPSI method. These results are applied for the studying the deformation mechanisms of the thermal stress as well as the crack initiation and propagation in the PV structure. Technical solution is provided for reducing or eliminating the residual deformation and the thermal cyclic behavior on the structure is studied.