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The pros and cons of very-low-voltage testing: an analysis based on resistive bridging faults

机译:低压测试的优点和缺点:基于电阻桥接故障的分析

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Test application at reduced power supply voltage (or VLV testing) is a cost-effective way to increase the defect coverage of a test set. Resistive short defects are a major contributor to this coverage increase. Using a probabilistic model of these defects, we quantify the coverage impact of VLV testing for different voltages. When considering the coverage increase, we differentiate between defects missed by the test set at nominal voltage and undetectable defects (flaws) detected by VLV testing. In our analysis, the performance degradation of the device caused by lower power supply voltage is accounted for. Furthermore, we describe a situation in which defects detected by conventional testing are missed by VLV testing and quantify the resulting coverage loss. We report the numbers on the increased defect coverage, flaw coverage, and coverage loss for ISCAS circuits.
机译:测试应用在降低的电源电压(或VLV测试)是一种成本有效的方法,可以增加测试集的缺陷覆盖。电阻短缺是这种覆盖范围增加的主要贡献者。使用这些缺陷的概率模型,我们量化了VLV测试对不同电压的覆盖影响。在考虑覆盖范围的增加时,我们在VLV测试检测到的标称电压和未检测到的检测到未检测到的未检测到的缺陷(缺陷)之间的缺陷之间区分。在我们的分析中,占据了较低电源电压引起的设备的性能劣化。此外,我们描述了通过VLV测试错过了通过常规测试检测到的缺陷的情况,并量化了所得到的覆盖损耗。我们报告了ISCAS电路的增加的缺陷覆盖,漏洞覆盖范围,漏洞覆盖范围和覆盖损失。

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