Pad conditioning process is one of the crucial process steps during chemical-mechanical planarization (CMP). Pad needs to be conditioned at regular time intervals to regenerate a rough surface in order to maintain consistent and optimum polishing process. Inconsistent pad conditioning directly affects the repeatability of the process outcome. Thus, it is essential to study the factors influencing the conditioning process. In the present research, the effect of temperature on the pad conditioning process has been investigated. Polishing pads were conditioned at different temperatures, during which the coefficient of friction and pad wear were monitored, then patterned copper wafers were polished subsequently on a bench-top CMP tester mod. CP-4. Post-CMP wafer surfaces were characterized for dishing and surface non-uniformity. An atomic force microscope integrated into the Universal Nano & Micro Tester (UNMT) was used for imaging wide isolated lines for dishing characteristics.
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