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Silicon Carbide Delta-Doped Structures Formed by 'Pulse Doping' Technique in the Vertical Hot Wall Type CVD System

机译:通过“脉冲掺杂”技术在垂直热壁式CVD系统中形成的碳化硅三角形结构

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Delta-doped layers of silicon carbide (SiC) have been investigated by our original "Pulse Doping" technique during epitaxial growth in the vertical hot wall type chemical vapor deposition (CVD) system. This CVD system was equipped with a graphite crucible in which the substrate was set surface-down. The dopant gases are intermittently introduced and managed utilizing the pulse valve, which can open and close within <10μs. Carrier concentrations of the uniformly doped layers were precisely controlled by variation of the period of this valve. Moreover, "Pulse Doping" technique enabled formation of very abrupt interface between doped and undoped layers. The delta-doped layers with narrow width less than 20nm were successfully formed. Furthermore, the stratified structures of the delta-doped layers were achieved in the SiC epitaxial films for the first time.
机译:通过我们的原始“脉冲掺杂”技术在垂直热壁式化学气相沉积(CVD)系统中的外延生长期间研究了掺杂的碳化硅(SiC)的碳化硅(SiC)。该CVD系统配备有石墨坩埚,其中基板被设置为下落。掺杂剂气体间歇地引入和管理利用脉冲阀,可以在<10μs内打开和靠近。通过该阀的时期的变化精确地控制均匀掺杂层的载体浓度。此外,“脉冲掺杂”技术使能在掺杂和未掺杂层之间形成非常突然的界面。成功地形成了窄宽度小于20nm的δ掺杂层。此外,首次在SiC外延膜中实现了δ掺杂层的分层结构。

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