The adhesion force of silica and pad particles on Cu wafer surfaces were theoretically and experimentally investigated in slurry solutions of different pHs with and without the addition of a corrosion inhibitor, 1H-benzotriazole (BTAH). Isoelectric point (IEP) of pad particles was measured to be around 3. Pad particles showed a lower adhesion force in DI water than silica, however resulted in a higher force when BTA was added in DI water. The magnitude of adhesion force of pad particles increased as a function of BTA concentration. The lowest zeta potential of silica particles was measured when 0.01 wt% of BTA was added in DI water. A higher adhesion force was measured on silica particles at pH 3 with the presence of BTA. The increase of pH to neutral to alkaline significantly reduced the adhesion forces of both silica and pad particles
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