The main purpose of this 2,5 MECU EC funded project is to establish a solid industrial basis capable of exploiting the technology of MCMs with active substrate. These modules use flip-chip attachment technology to connect silicon chips to a silicon substrate, and this assembly is then packaged into a plastic ball grid array package. I/Os of the silicon chips are rerouted from the periphery to the whole area of the chip. This paper outlines developments in SUMMIT which among other involve: 1. Design, development and test of a mixed cell library. The use of silicon substrates suggest their capability to contain active components. Digital and analog cells are part of the library as well as a set of passive components (resistors, capacitors & inductors). 2. Design, development and test of inductors for RF applications. 3. MCM testability: Boundary Scan Cells, Built-in Test Structures. 4. Quality insurance and homologation test on real MCMs. 5. Design, development and test of two real demonstrators: the first one includes a consumer application (low cost GPS) and the second one a high end digital application for digital signal processing. 6. Cost Accounting: Modelling and forecasting Developments are linked to three different MCM fabrication runs: test vehicle, verification of the design libraries and demonstrators. The consortium consists of several research centres and private companies: CNM (Spain), Dassault Elec. (France), Sibet GmbH (Germany), NMRC (Ireland), ETH (Switzerland) and Dicryl S.A. (Spain), acting as coordinator.
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