首页> 外文会议>Conference on Information Storage and Processing Systems >A METHOD TO REDUCE HEAD-DISK INTERFACE (HDI) DEGRADATION RISK DURING THERMAL ASPERITY (TA) MAPPING IN A HARD DISK DRIVE
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A METHOD TO REDUCE HEAD-DISK INTERFACE (HDI) DEGRADATION RISK DURING THERMAL ASPERITY (TA) MAPPING IN A HARD DISK DRIVE

机译:在硬盘驱动器中减少热粗糙度(TA)映射期间的头磁盘接口(HDI)劣化风险的方法

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One of the issues in thermal asperity (TA) detection using an embedded contact sensor (ECS) is the degradation caused to the read/write elements of the head while interacting with the TA. We propose a method to reduce such head-disk interaction (HDI) during TA detection and classification by flying higher at low thermal fly-height control (TFC) power, which minimizes the interaction of the TA with the head. The key idea is to scan the head at higher fly height, but with higher ECS bias voltage. Initial experiments have shown that the TA count follows a negative cubic relationship with the backoff at various bias levels, and that it follows a square relationship with bias at various backoff levels. Using a sample set, the calibration curves i.e. the golden relationship between these parameters can be established. Using these, one can start the TA detection at the highest backoff and high ECS bias, and start to estimate the nominal TA count. By mapping out these TAs and ensuring the head does not fly over them again to prevent HDI, the fly height can then be lowered, and the rest of the TA cluster can be scanned. Following this method iteratively, the entire TA cluster can be mapped out with minimal interaction with the head. Although this method entails an increase in the test time to detect and map all TAs, compared to detecting them with TFC being on, this can help improve the reliability of the drive by protecting the sensitive read/write elements especially for energy assisted recording from HDI.
机译:使用嵌入式接触传感器(ECS)的热粗糙度(TA)检测中的一个问题是对头部的读/写元件引起的劣化,同时与TA相互作用。我们提出了一种通过在低热飞行高度控制(TFC)功率下通过飞行更高的TA检测和分类期间减少此类头盘交互(HDI)的方法,这使TA与头部的相互作用最小化。关键的想法是在较高的飞行高度下扫描头部,但ECS偏置电压较高。初步实验表明,TA计数遵循与各种偏置水平的退避的负立方关系,并且它遵循各种退避级别的偏差的平方关系。使用样本集,可以建立这些参数之间的黄金关系。使用这些,可以在最高退避和高ECS偏置处启动TA检测,并开始估计标称TA计数。通过映射出这些TA并确保头部不会再次飞过它们来防止HDI,然后可以降低飞行高度,并且可以扫描TA簇的其余部分。在此方法迭代之后,可以使用与头部最小的相互作用映射整个TA簇。虽然这种方法需要增加测试时间来检测和映射所有TAS,但与TFC检测到ON相比,这可以通过保护敏感读/写元件来提高驱动器的可靠性,尤其是从HDI的能量辅助记录的能量辅助记录。

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