首页> 外文会议>International Conference on Signal Processing and Communication >Empirical study of identifying gaps between users expectation and experience in the verification methodologies of semiconductor industry
【24h】

Empirical study of identifying gaps between users expectation and experience in the verification methodologies of semiconductor industry

机译:识别用户期望与半导体行业验证方法经验之间差距的实证研究

获取原文

摘要

Independent of the application field, major factors in focus when using the products are quality, cost and time. Empirical studies have shown that in IC design projects as much as half of the projected schedule is spent on the verification activities. Our research work involved exploring the current state of practice of the verification process, investigating methods for achieving efficient fault detection during the product verification, implementation of accumulated knowledge and techniques for efficient verification in one real-world practical case and analysing the impact of the current verification process in terms of time, cost and quality of product verification. This paper covers the views of verification experts in semiconductor industry on latest verification techniques. It shows the most commonly used verification improvement activities that had been implemented by semiconductor companies and its impact on quality, cost and time of the products. The methodology encompassed survey and semi-structured interviews at VLSI companies. Experiments were done to evaluate the new verification methods before using them in real projects. This paper is mainly focussed on identifying the gaps between the expectation of the verification experts and their real experiences of latest verification techniques for product verification process in semiconductor industry.
机译:与应用领域无关,使用产品时要关注的主要因素是质量,成本和时间。经验研究表明,在IC设计项目中,多达一半的计划进度用于验证活动。我们的研究工作包括探索验证过程的当前状态,研究在产品验证过程中实现有效故障检测的方法,在一个实际案例中实施有效验证所积累的知识和技术,并分析当前的影响。验证过程包括时间,成本和产品验证质量。本文涵盖了半导体行业的验证专家对最新验证技术的看法。它显示了半导体公司已实施的最常用的验证改进活动及其对产品质量,成本和时间的影响。该方法包括在VLSI公司进行的调查和半结构化访谈。在实际项目中使用新的验证方法之前,已经进行了实验以评估新的验证方法。本文主要侧重于确定验证专家的期望与他们在半导体行业产品验证过程中最新验证技术的实际经验之间的差距。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号