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Effects of interface morphology and TGO thickness on residual stress of EB-PVD thermal barrier coatings

机译:界面形态和TGO厚度对EB-PVD热障涂层残余应力的影响

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The residual stress of electron beam-physical vapor deposition (EB-PVD) thermal barrier coatings (TBC) is complex and difficult to be obtained. In this paper, the interface morphology of TBCs subjected to cyclic heating and cooling was observed by SEM. Based on the thermal elastic-plastic finite method, corresponding interface model of TBCs was established. The residual stress of EB-PVD TBCs with different interface morphologies and TGO thicknesses was calculated using the FE method without regard to the presence of cracks and defects. The result shows that the distribution of residual stress is significantly affected by the interface morphology, and the growth of TGO also has influence on the residual stress of TC and TGO.
机译:电子束物理气相沉积(EB-PVD)热障涂层(TBC)的残余应力复杂且难以获得。本文通过扫描电镜观察了循环加热和冷却的TBCs的界面形态。基于热弹塑性有限元法,建立了相应的TBC界面模型。使用FE方法计算具有不同界面形态和TGO厚度的EB-PVD TBC的残余应力,而不考虑裂纹和缺陷的存在。结果表明,残余应力的分布受界面形态的影响很大,而TGO的生长也对TC和TGO的残余应力有影响。

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