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Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method

机译:使用Taguchi方法的工艺参数可变性对缩小的22nm PMOS阈值电压的影响

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This paper provides the enhancement of 22nm planar PMOS transistor technology through downscaling, design parameter simulation and optimization process. The scaled down device is optimized for its process parameter variability using Taguchi method. The aim is to find the best combination of fabrication parameters in order to achieve the target value of the threshold voltage (V). A combination of high permittivity material (high-k) and metal gate is utilized simultaneously in replacing the conventional SiO/Poly-Si technology. For this, Titanium dioxide (TiO) was used as the high-k material and tungsten silicide (WSi) was used as the metal gate. The simulation results show that the optimal threshold voltage (V) of −0.289 V ± 12.7% is achieved in accordance to the ITRS 2012 specifications. This provides a benchmark towards the fabrication of 22 nm planar PMOS in future work.
机译:本文通过缩小尺寸,设计参数仿真和优化过程来增强22nm平面PMOS晶体管技术。使用Taguchi方法对按比例缩小的设备的过程参数可变性进行了优化。目的是找到制造参数的最佳组合,以达到阈值电压(V)的目标值。高介电常数材料(high-k)和金属栅极的组合可同时用于替代传统的SiO / Poly-Si技术。为此,将二氧化钛(TiO)用作高k材料,并将硅化钨(WSi)用作金属栅极。仿真结果表明,根据ITRS 2012规范,可实现-0.289 V±12.7%的最佳阈值电压(V)。这为将来工作中制造22 nm平面PMOS提供了基准。

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